PAII 2016: internship opportunities in the U.S.

We have the pleasure to announce the internship offers for the Polish-American Internship Initiative 2016. Four companies have joined the Program: ADM, MoneyGram, Pittsburgh Glass Works and Stilwell Technology and Robotics. We cordially invite Polish students interested in this tremendous professional opportunity to submit the applications. The application deadline is December 10, 2015.

Internship and requirements are listed in our section FOR STUDENTS / Oferta staży. Before applying, please read our FOR STUDENTS section and check the eligibility criteria listed in the Rules of the Polish-American Internship Initiative.

The Polish-American Internship Initiative is a prestigious internship Program that enables outstanding Polish students to take part in summer internships at the best corporations in the United States. The Initiative was launched in 2010 by the Polish-American Freedom Foundation (PAFF) in cooperation with the U.S. Embassy in Poland. PAII is supported by the Trade and Investment Promotion Section of the Polish Embassy in the USA. The operational activities within the Program are carried out by the Educational Enterprise Foundation together with American companies off­ering internships.

PAII presents an opportunity to apply for a paid 2-3 month-long internship at American companies, a travel expenses subsidy and assistance in obtaining a visa. The internship is available for full-time students of the second year and above at Polish universities, with fluent command of English, achieving the highest academic results, who have already shown outstanding abilities and commitment.

Five editions of PAII have already been held with a total of 79 Polish interns at 8 American hosting companies: Boeing, Citi, GE Hitachi Nuclear Energy, Westinghouse Electric Company, Pittsburgh Glass Works, Sikorsky Aircraft Corporation/Otis, Chevron North America and Raytheon BBN Technologies. For the 2016 edition three new companies joined PAII: ADM, MoneyGram and Stilwell Technology and Robotics.